JPH0582981B2 - - Google Patents

Info

Publication number
JPH0582981B2
JPH0582981B2 JP61163032A JP16303286A JPH0582981B2 JP H0582981 B2 JPH0582981 B2 JP H0582981B2 JP 61163032 A JP61163032 A JP 61163032A JP 16303286 A JP16303286 A JP 16303286A JP H0582981 B2 JPH0582981 B2 JP H0582981B2
Authority
JP
Japan
Prior art keywords
pellet
lead frame
lead
size
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61163032A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318652A (ja
Inventor
Tetsuro Okatome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP16303286A priority Critical patent/JPS6318652A/ja
Publication of JPS6318652A publication Critical patent/JPS6318652A/ja
Publication of JPH0582981B2 publication Critical patent/JPH0582981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49506—Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16303286A 1986-07-11 1986-07-11 半導体装置の製造方法 Granted JPS6318652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16303286A JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16303286A JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6318652A JPS6318652A (ja) 1988-01-26
JPH0582981B2 true JPH0582981B2 (en]) 1993-11-24

Family

ID=15765889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16303286A Granted JPS6318652A (ja) 1986-07-11 1986-07-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6318652A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653400A (ja) * 1992-07-28 1994-02-25 Nec Corp リードフレーム
JP2809206B2 (ja) 1995-06-26 1998-10-08 松下電器産業株式会社 光ディスク記録再生方法及び光ディスク装置
KR19980067079A (ko) * 1997-01-31 1998-10-15 이대원 트랜지스터용 리드프레임 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141712A (en) * 1977-07-18 1979-02-27 Diacon Inc. Manufacturing process for package for electronic devices
JPS6095941A (ja) * 1983-10-31 1985-05-29 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPS6318652A (ja) 1988-01-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees